High-performance heat dissipation substrate with monoparticle layer

ABSTRACT

A high-performance heat dissipation substrate with monoparticle layer, including a surface plate having a first face connected to a heat source and a second face on which a heat dissipation substrate is disposed. The heat dissipation substrate is connectable to an external heat dissipation device. A thermal particle layer is disposed between the surface plate and the heat dissipation substrate in the form of a monoparticle layer. The thermal particle layer includes multiple thermal particles (ceramic materials as diamond, SiC, AIN, Single Crystal Silicon) arranged immediately adjacent to each other and partially inlaid in the surface plate and the heat dissipation substrate. The heat of the heat source can be transferred from the surface plate through the thermal particle layer to the heat dissipation substrate and dissipated outward.

BACKGROUND OF THE INVENTION

The present invention relates to a high-performance heat dissipationsubstrate with monoparticle layer, and more particularly to a heatdissipation substrate with higher heat conduction efficiency and widerapplication range.

Following the development and advance of semiconductor technique, it hasbecome a trend to miniaturize and sophisticate various semiconductorproducts. The semiconductor will generate heat when working. However,the semiconductor itself inherently has quite small heat dissipationsurface. Therefore, a mini-type high-power semiconductor, such ashigh-power light-emitting diode (LED), high-frequency component,high-power transistor component, etc., is generally provided with anexternal heat dissipation component (or radiating fins) with sufficientheat dissipation area for dissipating the heat. The heat is multistageconducted from the semiconductor to the external heat dissipationcomponent. Therefore, heat conduction efficiency of the mini-typesemiconductor (small-size electronic component) is a critical factor inheat dissipation as a whole.

Conventionally, a heat conduction layer is disposed between thesemiconductor and the packaging substrate thereof. In early stage, theheat conduction layer is made of an adhesive material simply formed ofresin or resin doped with ceramic micropowder. Such heat conductionlayer has a very poor thermal conductivity (lower than 5 W/m·k). As aresult, the heat dissipation effect provided by such heat conductionlayer is limited and it often takes place that the heat cannot bedissipated efficiently.

It is known that diamond particle itself has excellent thermalconductivity (1000 W/m·k). Therefore, some manufacturers apply diamondmaterial to heat conduction structures of semiconductor products. It iscommonly seen that diamond particles are ground into diamondmicropowder, which is added into resin or other adhesives as heatconduction material between the semiconductor heat source and the heatconduction substrate. However, in such structure, the diamondmicropowder is enclosed in the resin material with very poor thermalconductivity. This greatly deteriorates heat conduction effect of thediamond micropowder. Consequently, such structure can hardly achievesatisfying heat dissipation function. Moreover, the diamond particleshave an extremely high hardness and are hard to grind. Therefore, it isdifficult to grind and process the diamond particles into diamondmicroparticle. As a result, the manufacturing cost is increased. This isinconsistent with economic benefit.

U.S. Pat. No. 6,372,628 discloses an insulating diamond-like carbon filmdisposed between a heat source and a heat conduction substrate. Also,Taiwanese Patent Publication No. 200915505 discloses a high-performanceheat dissipation packaging substrate with an insulating diamond-likecarbon film. The insulating diamond-like carbon film serves to transferthe heat generated by the heat source (semiconductor) to the heatconduction substrate for dissipating the heat outward. Such diamond-likecarbon film has a thermal conductivity better than that of theconventional adhesive heat conduction layer formed of resin or resindoped with ceramic micropowder. However, in practice, the thermalconductivity of the diamond-like carbon film is lower than the thermalconductivity of diamond particles. Therefore, such diamond-like carbonfilm still can hardly achieve satisfying heat dissipation effect.

SUMMARY OF THE INVENTION

It is therefore a primary object of the present invention to provide ahigh-performance heat dissipation substrate with monoparticle layerformed with ceramic materials. The heat dissipation substrate hasexcellent thermal conductivity and is able to efficiently transfer heatgenerated by a heat source to a heat dissipation device for dissipatingthe heat outward.

It is a further object of the present invention to provide the abovehigh-performance heat dissipation substrate, which can be more easilyprocessed than the conventional heat conduction structure made of thesame material. Therefore, the manufacturing cost is lowered and thecompetitive ability is promoted.

To achieve the above and other objects, the high-performance heatdissipation substrate with monoparticle layer of the present inventionincludes: a surface plate at least having a first face and a secondface, the first face of the surface plate being connected to a heatsource; a heat dissipation substrate disposed on the second face of thesurface plate and connected to an external heat dissipation device; anda thermal particle layer including multiple thermal particles (such asparticles formed with ceramic material) arranged between the surfaceplate and the heat dissipation substrate for transferring heat from thesurface plate to the heat dissipation substrate.

In the above heat dissipation substrate, the thermal particles of thethermal particle layer are arranged in an array or a non-array.

In the above heat dissipation substrate, an adhesive bonding material isfilled between the thermal particles of the thermal particle layer.

The present invention can be best understood through the followingdescription and accompanying drawings wherein:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective exploded view of the present invention;

FIG. 2 is a sectional assembled view of the present invention; and

FIG. 3 is an enlarged view of a part of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1 to 3. The present invention includes a surfaceplate 1, a heat dissipation substrate 2 and a thermal particle layer 3.The surface plate 1 is a sheet member having a first face and a secondface. The first face of the surface plate 1 is connected to a heatsource 4 (such as a semiconductor or a heat-generating component). Theheat dissipation substrate 2 is disposed on the second face of thesurface plate 1. The heat dissipation substrate 2 has larger heatdissipation area itself. Alternatively, the heat dissipation substrate 2is connected to an external heat dissipation device (such as radiatingfins or the like). The thermal particle layer 3 is disposed between thesurface plate 1 and the heat dissipation substrate 2 in the form of amonoparticle layer. The thermal particle layer 3 includes multiplethermal particles 31 (such as particles formed with ceramic materialdiamond, SiC, AIN, Single Crystal Silicon) arranged immediately adjacentto each other (in an array or non-array). The thermal particles 31 arepartially inlaid in the surface plate 1 or the heat dissipationsubstrate 2 so as to firmly and tightly connect and contact therewith bya large area. Accordingly, the heat can be efficiently transferred fromthe surface plate 1 through the thermal particle layer 3 to the heatdissipation substrate 2. An adhesive bonding material 32 is filledbetween the thermal particles 31 of the thermal particle layer 3. Themain composition of the bonding material 32 is pure epoxy or epoxy addedwith SiC powder. The bonding material 32 not only serves to bond thethermal particles 31 to each other, but also is able to enhanceconnection strength between the surface plate 1 and the heat dissipationsubstrate 2.

In the above structure, the thermal particles 31 have an excellentthermal conductivity themselves and are extremely hard. Therefore, inthe case that the surface plate 1 and the heat dissipation substrate 2are pressed toward each other, at least some parts of the thermalparticles 31, especially the sharp sections thereof, will thrust intothe surface of the surface plate 1 or the heat dissipation substrate 2,which is generally made of metal material. Accordingly, the thermalparticles 31 can firmly and tightly connect and contact with the surfaceplate 1 and the heat dissipation substrate 2 by larger area to reducethermal resistance between the contact sections. Therefore, the heatgenerated by the heat source 4 can be uniformly distributed over thesurface plate 1 and efficiently transferred through the thermalparticles 31 of the thermal particle layer 3 to the heat dissipationsubstrate 2. The heat dissipation substrate 2 then conducts the heat tothe radiating fins or the like heat dissipation structures to dissipatethe heat. In comparison with the prior art, the present inventionachieves better heat dissipation effect and is easier to process.Therefore, the manufacturing cost is reduced and the competitive abilityis promoted.

In conclusion, the processing procedure of the high-performance heatdissipation substrate with monoparticle layer of the present inventionis simplified. In addition, the heat conduction effect of the heatdissipation substrate of the present invention is enhanced.

The above embodiments are only used to illustrate the present invention,not intended to limit the scope thereof. Many modifications of the aboveembodiments can be made without departing from the spirit of the presentinvention.

1. A high-performance heat dissipation substrate with monoparticlelayer, comprising: a surface plate at least having a first face and asecond face, the first face of the surface plate being connected to aheat source; a heat dissipation substrate disposed on the second face ofthe surface plate and connected to an external heat dissipation device;and a thermal particle layer including multiple thermal particlesarranged between the surface plate and the heat dissipation substratefor transferring heat from the surface plate to the heat dissipationsubstrate.
 2. The high-performance heat dissipation substrate withmonoparticle layer as claimed in claim 1, wherein the thermal particlesare ceramic material particles.
 3. The high-performance heat dissipationsubstrate with monoparticle layer as claimed in claim 2, wherein thethermal particles are selected from at lest one of ceramic materialssuch as diamond, SiC, AIN, Single Crystal Silicon.
 4. Thehigh-performance heat dissipation substrate with monoparticle layer asclaimed in claim 1, wherein the thermal particles of the thermalparticle layer are arranged in an array.
 5. The high-performance heatdissipation substrate with monoparticle layer as claimed in claim 1,wherein the thermal particles of the thermal particle layer are arrangedin a non-array.
 6. The high-performance heat dissipation substrate withmonoparticle layer as claimed in claim 1, wherein the thermal particlesof the thermal particle layer are arranged in the form of a monoparticlelayer.
 7. The high-performance heat dissipation substrate withmonoparticle layer as claimed in claim 1, wherein an adhesive bondingmaterial is filled between the thermal particles of the thermal particlelayer.
 8. The high-performance heat dissipation substrate withmonoparticle layer as claimed in claim 6, wherein an adhesive bondingmaterial is filled between the thermal particles of the thermal particlelayer.
 9. The high-performance heat dissipation substrate withmonoparticle layer as claimed in claim 7, wherein the bonding materialis formed of epoxy or epoxy added with SiC powder.
 10. Thehigh-performance heat dissipation substrate with monoparticle layer asclaimed in claim 8, wherein the bonding material is formed of epoxy orepoxy added with SiC powder.
 11. The high-performance heat dissipationsubstrate with monoparticle layer as claimed in claim 1, wherein twoopposite sides of the thermal particles are at least partially inlaid inthe surface plate and at least one heat dissipation substrate.
 12. Thehigh-performance heat dissipation substrate with monoparticle layer asclaimed in claim 2, wherein two opposite sides of the thermal particlesare at least partially inlaid in the surface plate and at least one heatdissipation substrate.
 13. The high-performance heat dissipationsubstrate with monoparticle layer as claimed in claim 3, wherein twoopposite sides of the thermal particles are at least partially inlaid inthe surface plate and at least one heat dissipation substrate.
 14. Thehigh-performance heat dissipation substrate with monoparticle layer asclaimed in claim 6, wherein two opposite sides of the thermal particlesare at least partially inlaid in the surface plate and at least one heatdissipation substrate.
 15. The high-performance heat dissipationsubstrate with monoparticle layer as claimed in claim 7, wherein twoopposite sides of the thermal particles are at least partially inlaid inthe surface plate and at least one heat dissipation substrate.
 16. Thehigh-performance heat dissipation substrate with monoparticle layer asclaimed in claim 8, wherein two opposite sides of the thermal particlesare at least partially inlaid in the surface plate and at least one heatdissipation substrate.
 17. The high-performance heat dissipationsubstrate with monoparticle layer as claimed in claim 9, wherein twoopposite sides of the thermal particles are at least partially inlaid inthe surface plate and at least one heat dissipation substrate.
 18. Thehigh-performance heat dissipation substrate with monoparticle layer asclaimed in claim 1, wherein the thermal particles are arrangedimmediately adjacent to each other.
 19. The high-performance heatdissipation substrate with monoparticle layer as claimed in claim 2,wherein the thermal particles are arranged immediately adjacent to eachother.
 20. The high-performance heat dissipation substrate withmonoparticle layer as claimed in claim 3, wherein the thermal particlesare arranged immediately adjacent to each other.